24 October 2025
The PERSIMMON project has reached a key milestone in the development of its next-generation smart patch technology. A first batch of custom-designed electronic boards has been assembled by DF Elettronica and sent to Uppsala University for encapsulation in silicone housings, making them semi-waterproof and ready for field testing.
These boards have now been distributed to project partners to begin initial data acquisition. While some early setup issues were identified including assembly defects, many units have already been reworked and are now operational. Partners are collaborating closely to ensure usability and to collect the first biomedical signals.
Each board integrates a prototype chip developed by STMicroelectronics, specifically designed for biomedical sensing. Although details remain confidential, the chip is expected to be released between late 2026 and early 2027.
Key features of the board include:
- Acquisition of up to three ECG channels, or combinations of ECG, bioimpedance, and GSR
- Integrated accelerometer, gyroscope, and magnetometer
- Temperature sensing via NTC
- Up to 12 configurable PPG modes
- Data storage onboard or transmission via Bluetooth or FAT-IBC protocol
Testing of the FAT-IBC interface is also underway in collaboration with Uppsala, with further contributions expected from Dr. Bappaditya Mandal’s team once their setup is ready.
This prototype marks a significant step toward realizing PERSIMMON’s vision of sustainable, AI-powered wearable health technologies.
